System on Package: Miniaturization of the Entire System

Tummala, R. R.

Ouvrage indisponible

Éditeur
McGraw-Hill Professional
Pages
785
Parution
avril 2008
Format
Cartonné
Langue
Anglais
Dimensions
242 × 193 × 33 cm
EAN
9780071459068
  • Résumé

"System-on-Package" (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. This book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this packaging technology can be used to solve pressing electronics design challenges.
Bio de l'auteur
Sommaire / contenu
Nous vous suggérons aussi
Retour en haut de page