Area Array Packaging Processes

Gilleo, Ken

Ouvrage indisponible

Éditeur
McGraw-Hill Professional
Pages
272
Parution
octobre 2003
Format
Livre broché
Langue
Anglais
Dimensions
191 × 235 × 14 cm
EAN
9780071738019
  • Résumé

This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products.
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